board-image-intake

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Use when: Extracting technical information, identifying components, or making an initial inventory from hardware images (PCBs, circuit assemblies, teardowns). Generates structured visual observations and a component inventory table. Erste Bildsichtung, Bauteilerfassung aus Fotos, PCB-Bestandsaufnahme, Bauteil identifizieren aus Bild.

MoriDj By MoriDj schedule Updated 4/5/2026

name: board_image_intake description: "Use when: Extracting technical information, identifying components, or making an initial inventory from hardware images (PCBs, circuit assemblies, teardowns). Generates structured visual observations and a component inventory table. Erste Bildsichtung, Bauteilerfassung aus Fotos, PCB-Bestandsaufnahme, Bauteil identifizieren aus Bild."

Analyzes one or more hardware images and produces a structured technical baseline: what is visible, what components can be identified, and what remains uncertain. Typically Phase 1 of a fault diagnosis workflow. - One or more board images (front / back / detail shots) - Optional: Known symptom or defect description for focused attention 1. Distinguish board sides (front / back / detail view) and label each observation accordingly. 2. Identify all visible components: connectors, switches, transistors, ICs, passives, motor terminals, charge ports. 3. Record visible markings exactly as they appear — do not interpret unclear markings, transcribe them literally. 4. Highlight larger discrete components and any visible damage (burn marks, cracked pads, lifted components, corrosion). 5. Mark areas that are unclear, obscured, low-resolution, or covered by solder mask as uncertain. Create two files in the `analysis/` folder (or the folder specified by the user).

File 1 — Visual Observations (suggest filename: 01_image_observations.md)

  • Board overview: estimated dimensions, layer count guess, manufacturing quality
  • Per-side description: front and back separated
  • Notable features: visible traces, ground planes, heat marks, mechanical damage
  • Areas of uncertainty with reason (blur, angle, solder mask)

File 2 — Component Inventory (suggest filename: 02_component_inventory.md) Table with columns: ID | Position | Visible Marking | Suspected Type | Suspected Function | Confidence

Example rows:

ID Position Visible Marking Suspected Type Suspected Function Confidence
U1 Center-left, top side "TP4056" Li-Ion Charge IC Battery charging control High
Q1 Near motor connector "S8050" NPN BJT Motor driver / load switch Medium
J1 PCB edge, 2-pin Battery connector Power input High
R3 Adjacent to U1 "102" Resistor 1 kΩ Current sense / bias High
IC1 Top-right "A3C" (partial) Unknown SMD IC Undetermined Low
- Confidence levels: High = full marking readable and package matches expected type; Medium = partial marking or pattern match only; Low = package visible but marking illegible or ambiguous. - When a marking is unclear, list multiple plausible interpretations rather than committing to one. Never assert definitive identification for an ambiguous marking. - Record markings exactly as seen, including partial text, rotated characters, or single digits.
Install via CLI
npx skills add https://github.com/MoriDj/ElectronicDiagnoseAgent --skill board-image-intake
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